Bondline Electronic Adhesives is committed to adhesive products' highest quality through dedication to product reliability, conformance to specifications, and timely delivery. We are committed to distinguishing ourselves as a reliable and responsive adhesive company serving customers domestically and internationally.

Bondline 2080

Silver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure.

Bondline 2106

Flexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C.

Bondline 2111

Flexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure.

Bondline 2120

Silver filled, low viscosity, room temperature cure epoxy adhesive. Electrical grounding, recording heads, quick cure. Low volume resistivity, room temperature cure options.

Bondline 2121

Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.

Bondline 2156

A resilient tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion ,low volume resistivity and thermal conductivity.

Bondline 2158

A tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure.

Bondline 2258

Flexible, silver filled epoxy for Bonding chips to substrate with mismatch in CTE. Great for die sizes greater than .400 sq. in to flex-circuit miniature LCD display. Semiconductor Grade.

Bondline 2485

Silver filled, snap cure adhesive, microelectronic chip bonding, automatic dispensing. Quick cure. 10 day work life, low volume resistivity, 2.57 w/mK - Thermal Conductivity.

Bondline 2490

Electrically conductive epoxy adhesive for chip bonding. Microelectronic applications, automatic dispensing, screen printing or hand dispense, high Tg 143° C.

Bondline 2900

Silver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.

Bondline 2900LV

Low viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.